JPS574239U - - Google Patents
Info
- Publication number
- JPS574239U JPS574239U JP7900780U JP7900780U JPS574239U JP S574239 U JPS574239 U JP S574239U JP 7900780 U JP7900780 U JP 7900780U JP 7900780 U JP7900780 U JP 7900780U JP S574239 U JPS574239 U JP S574239U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980079007U JPS6225907Y2 (en]) | 1980-06-06 | 1980-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980079007U JPS6225907Y2 (en]) | 1980-06-06 | 1980-06-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS574239U true JPS574239U (en]) | 1982-01-09 |
| JPS6225907Y2 JPS6225907Y2 (en]) | 1987-07-02 |
Family
ID=29441507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980079007U Expired JPS6225907Y2 (en]) | 1980-06-06 | 1980-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225907Y2 (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59130266A (ja) * | 1976-07-23 | 1984-07-26 | ザ・グッドイヤ−・タイヤ・アンド・ラバ−・カンパニ− | スルフイルイミン類 |
| JPS61131845U (en]) * | 1985-02-05 | 1986-08-18 | ||
| JPS63244657A (ja) * | 1987-03-30 | 1988-10-12 | Toshiba Corp | 半導体装置 |
| JPH01120041A (ja) * | 1987-07-20 | 1989-05-12 | Linear Technol Inc | 集積回路パッケージ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085752U (en]) * | 1973-12-10 | 1975-07-22 | ||
| JPS546567U (en]) * | 1977-06-17 | 1979-01-17 |
-
1980
- 1980-06-06 JP JP1980079007U patent/JPS6225907Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085752U (en]) * | 1973-12-10 | 1975-07-22 | ||
| JPS546567U (en]) * | 1977-06-17 | 1979-01-17 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59130266A (ja) * | 1976-07-23 | 1984-07-26 | ザ・グッドイヤ−・タイヤ・アンド・ラバ−・カンパニ− | スルフイルイミン類 |
| JPS61131845U (en]) * | 1985-02-05 | 1986-08-18 | ||
| JPS63244657A (ja) * | 1987-03-30 | 1988-10-12 | Toshiba Corp | 半導体装置 |
| JPH01120041A (ja) * | 1987-07-20 | 1989-05-12 | Linear Technol Inc | 集積回路パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6225907Y2 (en]) | 1987-07-02 |